Xizhou Li

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Tianshui, CN

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Patents Grantslast 30 patents

Information Patent Grant
SiP system-integration IC chip package and manufacturing method the...
- Patent number 9,349,615
- Issue date May 24, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense-pitch small-pad copper wire bonded double IC chip stack packa...
- Patent number 9,312,242
- Issue date Apr 12, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DENSE-PITCH SMALL-PAD COPPER WIRE BONDED DOUBLE IC CHIP STACK PACKA...
- Publication number 20150061099
- Publication date Mar 5, 2015
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP SYSTEM-INTEGRATION IC CHIP PACKAGE AND MANUFACTURING METHOD THE...
- Publication number 20130214386
- Publication date Aug 22, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS