Xu Sheng Bao

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an embedded conductive layer for power/...
- Patent number 11,488,838
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded conductive laye...
- Patent number 10,741,416
- Issue date Aug 11, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded conductive laye...
- Patent number 9,685,350
- Issue date Jun 20, 2017
- STATS ChipPAC, Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EWLB semiconductor packa...
- Patent number 9,620,557
- Issue date Apr 11, 2017
- STATS ChipPAC Pte. Ltd.
- Seng Guan Chow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with passivation island for reducing stress o...
- Patent number 7,968,445
- Issue date Jun 28, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with passivation island for reducing stress o...
- Patent number 7,667,335
- Issue date Feb 23, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Embedded Conductive Laye...
- Publication number 20200335358
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Conductive Laye...
- Publication number 20170263470
- Publication date Sep 14, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EWLB Semiconductor Packa...
- Publication number 20160104731
- Publication date Apr 14, 2016
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Embedded Conductive Laye...
- Publication number 20140252573
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Passivation Island for Reducing Stress o...
- Publication number 20100105200
- Publication date Apr 29, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Package with Passivation Island for Reducing Stress o...
- Publication number 20090079070
- Publication date Mar 26, 2009
- STATS ChipPAC, Ltd.
- Yaojian Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Xu Sheng Bao

Person

Patents Grantslast 30 patents

Semiconductor device having an embedded conductive layer for power/...

Semiconductor device and method of forming embedded conductive laye...

Semiconductor device and method of forming embedded conductive laye...

Semiconductor device and method of forming EWLB semiconductor packa...

Semiconductor package with passivation island for reducing stress o...

Semiconductor package with passivation island for reducing stress o...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Embedded Conductive Laye...

Semiconductor Device and Method of Forming Embedded Conductive Laye...

Semiconductor Device and Method of Forming EWLB Semiconductor Packa...

Semiconductor Device and Method of Forming Embedded Conductive Laye...

Semiconductor Package with Passivation Island for Reducing Stress o...

Semiconductor Package with Passivation Island for Reducing Stress o...