Xuan Lin

Person

Orange, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for filling vias in the microelectronics
- Patent number 10,541,140
- Issue date Jan 21, 2020
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper filling of through silicon vias
- Patent number 10,221,496
- Issue date Mar 5, 2019
- MacDermid Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 9,613,858
- Issue date Apr 4, 2017
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 9,493,884
- Issue date Nov 15, 2016
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated circuits with improved contact structures
- Patent number 9,287,213
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES, INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 9,222,188
- Issue date Dec 29, 2015
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for fabricating integrated circuits with improved contact s...
- Patent number 9,040,421
- Issue date May 26, 2015
- GLOBALFOUNDRIES, INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,771,495
- Issue date Jul 8, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 8,608,933
- Issue date Dec 17, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and composition for electrodeposition of copper in microelec...
- Patent number 8,388,824
- Issue date Mar 5, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 8,002,962
- Issue date Aug 23, 2011
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface preparation process for damascene copper deposition
- Patent number 7,998,859
- Issue date Aug 16, 2011
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper deposition for filling features in manufacture of microelect...
- Patent number 7,968,455
- Issue date Jun 28, 2011
- Enthone Inc.
- Xuan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 7,815,786
- Issue date Oct 19, 2010
- Enthone Inc.
- Vincent Paneccasio, Jr.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper metallization of through silicon via
- Patent number 7,670,950
- Issue date Mar 2, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect reduction in electrodeposited copper for semiconductor appli...
- Patent number 7,316,772
- Issue date Jan 8, 2008
- Enthone Inc.
- John Commander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper electrodeposition in microelectronics
- Patent number 7,303,992
- Issue date Dec 4, 2007
- Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive-assisted, cerium-based, corrosion-resistant e-coating
- Patent number 7,241,371
- Issue date Jul 10, 2007
- The Curators of University of Missouri
- James O. Stoffer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cerium-based spontaneous coating process for corrosion protection o...
- Patent number 7,048,807
- Issue date May 23, 2006
- The Curators of the University of Missouri
- James O. Stoffer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Additive-assisted cerium-based electrolytic coating process for cor...
- Patent number 6,818,116
- Issue date Nov 16, 2004
- The Curators of the University of Missouri
- James O. Stoffer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposition of cerium-based coatings for corrosion protection...
- Patent number 5,932,083
- Issue date Aug 3, 1999
- The Curators of the University of Missouri
- James O. Stoffer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20190003068
- Publication date Jan 3, 2019
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20170029972
- Publication date Feb 2, 2017
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Filling Vias in the Microelectronics
- Publication number 20160254156
- Publication date Sep 1, 2016
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUITS WITH IMPROVED CONTACT STRUCTURES
- Publication number 20150235957
- Publication date Aug 20, 2015
- GLOBAL FOUNDRIES, INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20140327140
- Publication date Nov 6, 2014
- GLOBALFOUNDRIES, Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20140322912
- Publication date Oct 30, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS
- Publication number 20140120722
- Publication date May 1, 2014
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20140102909
- Publication date Apr 17, 2014
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...
- Publication number 20130241060
- Publication date Sep 19, 2013
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FILLING OF THROUGH SILICON VIAS
- Publication number 20130199935
- Publication date Aug 8, 2013
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20120043218
- Publication date Feb 23, 2012
- Enthone Inc.
- Vincent Paneccasio, JR.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...
- Publication number 20100285660
- Publication date Nov 11, 2010
- Enthone Inc.
- Xuan Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...
- Publication number 20100126872
- Publication date May 27, 2010
- ENTHONE, INC.
- Vincent Paneccasio, JR.
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION
- Publication number 20100075496
- Publication date Mar 25, 2010
- Enthone Inc.
- Qingyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER METALLIZATION OF THROUGH SILICON VIA
- Publication number 20090035940
- Publication date Feb 5, 2009
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE
- Publication number 20080236619
- Publication date Oct 2, 2008
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...
- Publication number 20080121527
- Publication date May 29, 2008
- Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
- Publication number 20070289875
- Publication date Dec 20, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrodeposition in microelectronics
- Publication number 20070178697
- Publication date Aug 2, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrodeposition in microelectronics
- Publication number 20060141784
- Publication date Jun 29, 2006
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrodeposition in microelectronics
- Publication number 20050045488
- Publication date Mar 3, 2005
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Additive-assisted, cerium-based, corrosion-resistant e-coating
- Publication number 20040026261
- Publication date Feb 12, 2004
- James O. Stoffer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cerium-based spontaneous coating process for corrosion protection o...
- Publication number 20040028820
- Publication date Feb 12, 2004
- James O. Stoffer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Additive-assisted cerium-based electrolytic coating process for cor...
- Publication number 20040026260
- Publication date Feb 12, 2004
- James O. Stoffer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Defect reduction in electrodeposited copper for semiconductor appli...
- Publication number 20030168343
- Publication date Sep 11, 2003
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Process for filling vias in the microelectronics

Copper filling of through silicon vias

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Integrated circuits with improved contact structures

Defect reduction in electrodeposited copper for semiconductor appli...

Methods for fabricating integrated circuits with improved contact s...

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Method and composition for electrodeposition of copper in microelec...

Copper electrodeposition in microelectronics

Surface preparation process for damascene copper deposition

Copper deposition for filling features in manufacture of microelect...

Copper electrodeposition in microelectronics

Copper metallization of through silicon via

Defect reduction in electrodeposited copper for semiconductor appli...

Copper electrodeposition in microelectronics

Additive-assisted, cerium-based, corrosion-resistant e-coating

Cerium-based spontaneous coating process for corrosion protection o...

Additive-assisted cerium-based electrolytic coating process for cor...

Electrodeposition of cerium-based coatings for corrosion protection...

Patents Applicationslast 30 patents

COPPER FILLING OF THROUGH SILICON VIAS

Copper Electrodeposition in Microelectronics

Process for Filling Vias in the Microelectronics

INTEGRATED CIRCUITS WITH IMPROVED CONTACT STRUCTURES

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELEC...

COPPER FILLING OF THROUGH SILICON VIAS

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECT...

ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASE...

SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION

COPPER METALLIZATION OF THROUGH SILICON VIA

COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE

DEFECT REDUCTION IN ELECTRODEPOSITED COPPER FOR SEMICONDUCTOR APPLI...

COPPER ELECTRODEPOSITION IN MICROELECTRONICS

Copper electrodeposition in microelectronics

Copper electrodeposition in microelectronics

Copper electrodeposition in microelectronics

Additive-assisted, cerium-based, corrosion-resistant e-coating

Cerium-based spontaneous coating process for corrosion protection o...

Additive-assisted cerium-based electrolytic coating process for cor...

Defect reduction in electrodeposited copper for semiconductor appli...