TREA

Xuanjie Liu

Follow

Person

  • Shanghai, CN
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Image sensor and manufacturing method therefor
    • Patent number 10,784,296
    • Issue date Sep 22, 2020
    • Semiconductor Manufacturing (Shanghai) International Corporation
    • Tzu Yin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Image sensor including doped regions and manufacturing method therefor
    • Patent number 10,629,646
    • Issue date Apr 21, 2020
    • Semiconductor Manufacturing (Shanghai) International Corporation
    • Tzu Yin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing a vertical inductor
    • Patent number 10,319,518
    • Issue date Jun 11, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Dekui Qi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    TSV layout structure and TSV interconnect structure, and fabricatio...
    • Patent number 10,141,244
    • Issue date Nov 27, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Wuzhi Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Vertical inductor and method of manufacturing the same
    • Patent number 9,984,819
    • Issue date May 29, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Dekui Qi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    MEMS capping method
    • Patent number 9,731,960
    • Issue date Aug 15, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Lushan Jiang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    MEMS device and fabrication method
    • Patent number 9,731,962
    • Issue date Aug 15, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Xuanjie Liu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Semiconductor die and die cutting method
    • Patent number 9,613,865
    • Issue date Apr 4, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Jyishyang Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    MEMS device and fabrication method
    • Patent number 9,371,223
    • Issue date Jun 21, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Xuanjie Liu
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    MEMS capping method
    • Patent number 9,290,378
    • Issue date Mar 22, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Lushan Jiang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR
    • Publication number 20190252422
    • Publication date Aug 15, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tzu Yin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A VERTICAL INDUCTOR
    • Publication number 20180247762
    • Publication date Aug 30, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Dekui Qi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR
    • Publication number 20180175082
    • Publication date Jun 21, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tzu Yin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR
    • Publication number 20180175098
    • Publication date Jun 21, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Tzu Yin Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMS DEVICE AND FABRICATION METHOD
    • Publication number 20160264409
    • Publication date Sep 15, 2016
    • Semiconductor Manufacturing International (Shangha) Corporation
    • XUANJIE LIU
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    SEMICONDUCTOR DIE AND DIE CUTTING METHOD
    • Publication number 20160204071
    • Publication date Jul 14, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Jyishyang Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMS CAPPING METHOD
    • Publication number 20160152467
    • Publication date Jun 2, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • LUSHAN JIANG
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS CAPPING METHOD
    • Publication number 20150298968
    • Publication date Oct 22, 2015
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Jiang Lushan
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Vertical Inductor and Method of Manufacturing the Same
    • Publication number 20150302975
    • Publication date Oct 22, 2015
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Dekui Qi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMS DEVICE AND FABRICATION METHOD
    • Publication number 20150001632
    • Publication date Jan 1, 2015
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • XUANJIE LIU
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    TSV LAYOUT STRUCTURE AND TSV INTERCONNECT STRUCTURE, AND FABRICATIO...
    • Publication number 20140291856
    • Publication date Oct 2, 2014
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • WUZHI ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS