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Hillsboro, OR, US
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Patent Application
VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...
Publication number
20220199462
Publication date
Jun 23, 2022
Intel Corporation
Gurpreet Singh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
GUIDED VIAS IN MICROELECTRONIC STRUCTURES
Publication number
20220199540
Publication date
Jun 23, 2022
Intel Corporation
Gurpreet Singh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES
Publication number
20210375745
Publication date
Dec 2, 2021
Intel Corporation, Santa Clara, CA
James Munro Blackwell
H01 - BASIC ELECTRIC ELEMENTS