Xue Bai

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for controlling semiconductor die warpage
- Patent number 8,710,629
- Issue date Apr 29, 2014
- QUALCOMM Incorporated
- Xue Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Controlling Semiconductor Die Warpage
- Publication number 20110147895
- Publication date Jun 23, 2011
- QUALCOMM Incorporated
- Xue Bai
- H01 - BASIC ELECTRIC ELEMENTS