Xue Hua Wu

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Union City, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Etching process to selectively remove copper plating seed layer
- Patent number 6,767,477
- Issue date Jul 27, 2004
- Headway Technologies, Inc.
- Xue Hua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Masking frame plating method for forming masking frame plated layer
- Patent number 6,627,390
- Issue date Sep 30, 2003
- Headway Technologies, Inc.
- Xue Hua Wu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Etching process to selectively remove copper plating seed layer
- Publication number 20020168223
- Publication date Nov 14, 2002
- HEADWAY TECHNOLOGIES, INC.
- Xue Hua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Masking frame plating method for forming masking frame plated layer
- Publication number 20010036601
- Publication date Nov 1, 2001
- HEADWAY TECHNOLOGIES, INC.
- Xue Hua Wu
- G11 - INFORMATION STORAGE