Xue Ren ZHANG

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structural member
- Patent number 9,704,726
- Issue date Jul 11, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structural member
- Patent number 9,142,487
- Issue date Sep 22, 2015
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of packaging semiconductor devices
- Patent number 8,647,924
- Issue date Feb 11, 2014
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structural member
- Patent number 8,384,203
- Issue date Feb 26, 2013
- United Test & Assembly Center Ltd.
- Chin Hock Toh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURAL MEMBER
- Publication number 20160005629
- Publication date Jan 7, 2016
- UTAC Headquarters Pte. Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURAL MEMBER
- Publication number 20130119560
- Publication date May 16, 2013
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20100261313
- Publication date Oct 14, 2010
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20100109169
- Publication date May 6, 2010
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURAL MEMBER
- Publication number 20100013081
- Publication date Jan 21, 2010
- United Test & Assembly Center Ltd.
- Chin Hock TOH
- H01 - BASIC ELECTRIC ELEMENTS