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Xuefeng ZHANG
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San Diego, CA, US
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last 30 patents
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Patent Grant
Flip-chip device
Patent number
11,417,622
Issue date
Aug 16, 2022
QUALCOMM Incorporated
Yangyang Sun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
Publication number
20240105688
Publication date
Mar 28, 2024
QUALCOMM Incorporated
Xia LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FLIP-CHIP DEVICE
Publication number
20210118834
Publication date
Apr 22, 2021
QUALCOMM Incorporated
Yangyang SUN
H01 - BASIC ELECTRIC ELEMENTS