Xuefeng ZHANG

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip device
- Patent number 11,417,622
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING
- Publication number 20240429141
- Publication date Dec 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...
- Publication number 20240421119
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
- Publication number 20240105688
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP DEVICE
- Publication number 20210118834
- Publication date Apr 22, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS