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Xuejun Ying
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having a die and through-substrate via
Patent number
9,659,900
Issue date
May 23, 2017
Maxim Intergrated Products, Inc.
Xuejun Ying
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded stacked wafers and methods of electroplating bonded stacked...
Patent number
9,331,048
Issue date
May 3, 2016
Maxim Integrated Products, Inc.
Quanbo Zou
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device having a die and through substrate-via
Patent number
9,196,587
Issue date
Nov 24, 2015
Maxim Integrated Products, Inc.
Xuejun Ying
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a through-substrate via
Patent number
9,105,750
Issue date
Aug 11, 2015
Maxim Integrated Products, Inc.
Arkadii V. Samoilov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for varied topographic MEMS cap process
Patent number
9,040,386
Issue date
May 26, 2015
Maxim Integrated Products, Inc.
Xuejun Ying
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bonded stacked wafers and methods of electroplating bonded stacked...
Patent number
8,970,043
Issue date
Mar 3, 2015
Maxim Integrated Products, Inc.
Quanbo Zou
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Deep trench capacitor with conformally-deposited conductive layers...
Patent number
8,963,287
Issue date
Feb 24, 2015
Maxim Integrated Products, Inc.
Lei Tian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a through-substrate via
Patent number
8,742,574
Issue date
Jun 3, 2014
Maxim Integrated Products, Inc.
Arkadii V. Samoilov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deep trench capacitor with conformally-deposited conductive layers...
Patent number
8,487,405
Issue date
Jul 16, 2013
Maxim Integrated Products, Inc.
Lei Tian
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH-SUBSTRATE VIA
Publication number
20160079197
Publication date
Mar 17, 2016
Maxim Integrated Products, Inc.
Xuejun Ying
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...
Publication number
20150132891
Publication date
May 14, 2015
Maxim Integrated Products, Inc.
Quanbo Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR VARIED TOPOGRAPHIC MEMS CAP PROCESS
Publication number
20150028455
Publication date
Jan 29, 2015
Maxim Integrated Products, Inc.
Xuejun Ying
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH SUBSTRATE-VIA
Publication number
20140264844
Publication date
Sep 18, 2014
Xuejun Ying
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA
Publication number
20130037948
Publication date
Feb 14, 2013
MAXIM INTEGRATED PRODUCTS, INC.
Arkadii V. Samoilov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITOR WITH CONFORMALLY-DEPOSITED CONDUCTIVE LAYERS...
Publication number
20120211865
Publication date
Aug 23, 2012
MAXIM INTEGRATED PRODUCTS, INC.
LEI TIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...
Publication number
20120193808
Publication date
Aug 2, 2012
MAXIM INTEGRATED PRODUCTS, INC.
Quanbo Zou
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PREVENTING CONTACT STICTION IN MICRO RELAYS
Publication number
20120194306
Publication date
Aug 2, 2012
MAXIM INTEGRATED PRODUCTS, INC.
Uppili Sridhar
H01 - BASIC ELECTRIC ELEMENTS