Xueping GUO

Follow

Person

Beijing City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible-substrate-based three-dimensional packaging structure and...
- Patent number 9,997,493
- Issue date Jun 12, 2018
- Institute of Microelectronics, Chinese Academy of Sciences
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded package method and structure
- Patent number 9,583,418
- Issue date Feb 28, 2017
- National Center for Advanced Packaging Co., Ltd.
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE-SUBSTRATE-BASED THREE-DIMENSIONAL PACKAGING STRUCTURE AND...
- Publication number 20160293573
- Publication date Oct 6, 2016
- Institute of Microelectronics, Chinese Academy of Sciences
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Embedded Package Method and Structure
- Publication number 20150091155
- Publication date Apr 2, 2015
- NATIONAL CENTER FOR ADVANCED PACKING CO., LTD.
- Xueping GUO
- H01 - BASIC ELECTRIC ELEMENTS