Xueping GUO

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wireless headset
- Patent number 12,170,868
- Issue date Dec 17, 2024
- Huawei Technologies Co., Ltd.
- Deliang Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Foldable Display Apparatus, Manufacturing Method Therefor, and Term...
- Publication number 20240373688
- Publication date Nov 7, 2024
- Honor Device Co., Ltd.
- Caihua Ding
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Dielectric Material Layer, Surface Treatment Method, Package Substr...
- Publication number 20240250016
- Publication date Jul 25, 2024
- Honor Device Co., Ltd.
- Xueping Guo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic Device and Chip Packaging Method
- Publication number 20240234334
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Chip Packaging Method
- Publication number 20240136304
- Publication date Apr 25, 2024
- Honor Device Co., Ltd.
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Body, Preparation Method Thereof, Terminal, and Electronic...
- Publication number 20230309281
- Publication date Sep 28, 2023
- Honor Device Co., Ltd.
- Le Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wireless Headset
- Publication number 20220386015
- Publication date Dec 1, 2022
- HUAWEI TECHNOLOGIES CO., LTD.
- Deliang Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDED PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR, AND TER...
- Publication number 20220254695
- Publication date Aug 11, 2022
- HUAWEI TECHNOLOGIES CO., LTD.
- Xueping GUO
- H01 - BASIC ELECTRIC ELEMENTS

Xueping GUO

Person

Patents Grantslast 30 patents

Wireless headset

Patents Applicationslast 30 patents

Foldable Display Apparatus, Manufacturing Method Therefor, and Term...

Dielectric Material Layer, Surface Treatment Method, Package Substr...

Electronic Device and Chip Packaging Method

Electronic Device and Chip Packaging Method

Package Body, Preparation Method Thereof, Terminal, and Electronic...

Wireless Headset

EMBEDDED PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR, AND TER...