Xuequan Yu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component package structure and electronic device
- Patent number 10,091,915
- Issue date Oct 2, 2018
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package structure and electronic device
- Patent number 9,839,167
- Issue date Dec 5, 2017
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and packaging method
- Patent number 9,484,311
- Issue date Nov 1, 2016
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20180049351
- Publication date Feb 15, 2018
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20150305210
- Publication date Oct 22, 2015
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND PACKAGING METHOD
- Publication number 20150102473
- Publication date Apr 16, 2015
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS