Xufeng TU

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Chongqing, CN

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE METHOD AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240321846
- Publication date Sep 26, 2024
- SIPLP MICROELECTRONICS (CHONGQING) LTD.
- Xufeng TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230170318
- Publication date Jun 1, 2023
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS