Xun XIANG

Person

Tianhe District, Guangzhou, Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Filter radio frequency module packaging structure and method for ma...
- Patent number 12,184,253
- Issue date Dec 31, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang Yan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip interconnection package structure and method
- Patent number 12,112,956
- Issue date Oct 8, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...
- Publication number 20250174565
- Publication date May 29, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
- Wei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240304556
- Publication date Sep 12, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Xun XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...
- Publication number 20240186254
- Publication date Jun 6, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...
- Publication number 20240007072
- Publication date Jan 4, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yingqiang YAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20230253333
- Publication date Aug 10, 2023
- GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERCONNECTION PACKAGE STRUCTURE AND METHOD
- Publication number 20220254651
- Publication date Aug 11, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20220149007
- Publication date May 12, 2022
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yuan BAO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Filter radio frequency module packaging structure and method for ma...

Chip interconnection package structure and method

Patents Applicationslast 30 patents

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD

EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...

CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...

FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...

CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD T...

CHIP INTERCONNECTION PACKAGE STRUCTURE AND METHOD

CHIP PACKAGING STRUCTURE AND METHOD