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Singapore, SG
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last 30 patents
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Patent Grant
Apparatus for aligning electronic components
Patent number
8,544,165
Issue date
Oct 1, 2013
Hong Kong Applied Science and Technology Research Institute Co., Ltd.
Chi Kuen Vincent Leung
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Patent Grant
Pulse-laser bonding method for through-silicon-via based stacking o...
Patent number
8,138,577
Issue date
Mar 20, 2012
Hong Kong Applied Science and Technology Research Institute Co., Ltd.
Xunqing Shi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking o...
Publication number
20090243046
Publication date
Oct 1, 2009
Xunqing Shi
H01 - BASIC ELECTRIC ELEMENTS