Xunqing Shu

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New Territories, HK

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method for through-silicon-via based 3D wafer stacking
- Patent number 7,683,459
- Issue date Mar 23, 2010
- Hong Kong Applied Science and Technology Research Institute Company, Ltd.
- Wei Ma
- H01 - BASIC ELECTRIC ELEMENTS