Xusheng Wu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with S/D bottom isolation and methods of formi...
- Patent number 12,148,669
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with metal gate stack
- Patent number 12,132,096
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-inducing silicon liner in semiconductor devices
- Patent number 12,113,118
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gaps between metal gates and method o...
- Patent number 12,100,625
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,996,353
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 11,948,998
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,935,954
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with corner isolation protection and methods o...
- Patent number 11,916,105
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with S/D bottom isolation and methods of formi...
- Patent number 11,854,896
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact feature and method of fabricati...
- Patent number 11,855,155
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with strained isolation features
- Patent number 11,837,662
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with metal gate stack
- Patent number 11,769,819
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gaps between metal gates and method o...
- Patent number 11,756,835
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-inducing silicon liner in semiconductor devices
- Patent number 11,728,405
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure and method with strain effect
- Patent number 11,621,350
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 11,444,179
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with channel-strain liner
- Patent number 11,430,890
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact spacers and methods of forming same
- Patent number 11,410,877
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gaps between metal gates and method o...
- Patent number 11,387,146
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,328,982
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact feature and method of fabricati...
- Patent number 11,302,784
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut dielectric feature and method of forming the same
- Patent number 11,145,650
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer fin structure
- Patent number 11,133,386
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air spacer and stress liner
- Patent number 11,121,236
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure and method with strain effect
- Patent number 11,094,821
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with metal g...
- Patent number 10,879,373
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with strained isolation features
- Patent number 10,868,174
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with channel-strain liner
- Patent number 10,840,375
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact spacers and methods of forming same
- Patent number 10,818,543
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK
- Publication number 20240387691
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD O...
- Publication number 20240387281
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES
- Publication number 20240379817
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH S/D BOTTOM ISOLATION AND METHODS OF FORMI...
- Publication number 20240379442
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20240312876
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...
- Publication number 20240250152
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH S/D BOTTOM ISOLATION AND METHODS OF FORMI...
- Publication number 20240105517
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
- Publication number 20240096971
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CORNER ISOLATION PROTECTION AND METHODS O...
- Publication number 20230387199
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH STRAINED ISOLATION FEATURES
- Publication number 20230387300
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK
- Publication number 20230378321
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Air Gaps Between Metal Gates And Method O...
- Publication number 20230369128
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enlarged Backside Contact
- Publication number 20230060786
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230035791
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bwo-Ning CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES
- Publication number 20220367677
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...
- Publication number 20220367684
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...
- Publication number 20220367685
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Air Gaps Between Metal Gates And Method O...
- Publication number 20220344216
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with S/D Bottom Isolation and Methods of Formi...
- Publication number 20220310452
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Corner Isolation Protection and Methods o...
- Publication number 20220310783
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20220262708
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
- Publication number 20220238661
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Structure and Method With Strain Effect
- Publication number 20210376149
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Structures In Multi-Gate Semiconductor Devices And Method...
- Publication number 20210273078
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...
- Publication number 20210226018
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Cut Dielectric Feature and Method of Forming the Same
- Publication number 20210118875
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK
- Publication number 20210119015
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Strained Isolation Features
- Publication number 20210104631
- Publication date Apr 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-Inducing Silicon Liner in Semiconductor Devices
- Publication number 20210098603
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Air Gaps Between Metal Gates and Method o...
- Publication number 20210098309
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device with S/D bottom isolation and methods of formi...

Semiconductor device structure with metal gate stack

Stress-inducing silicon liner in semiconductor devices

Semiconductor device with air gaps between metal gates and method o...

Air gap seal for interconnect air gap and method of fabricating the...

Isolation structures in multi-gate semiconductor devices and method...

Semiconductor device structure and method for forming the same

Semiconductor device with corner isolation protection and methods o...

Semiconductor device with S/D bottom isolation and methods of formi...

Semiconductor device having contact feature and method of fabricati...

Devices with strained isolation features

Semiconductor device structure with metal gate stack

Semiconductor device with air gaps between metal gates and method o...

Stress-inducing silicon liner in semiconductor devices

Transistor structure and method with strain effect

Isolation structures in multi-gate semiconductor devices and method...

Integrated circuits with channel-strain liner

Source/drain contact spacers and methods of forming same

Semiconductor device with air gaps between metal gates and method o...

Air gap seal for interconnect air gap and method of fabricating the...

Semiconductor device having contact feature and method of fabricati...

Gate cut dielectric feature and method of forming the same

Multi-layer fin structure

Semiconductor device with air spacer and stress liner

Transistor structure and method with strain effect

Structure and formation method of semiconductor device with metal g...

Devices with strained isolation features

Integrated circuits with channel-strain liner

Source/drain contact spacers and methods of forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK

SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD O...

STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH S/D BOTTOM ISOLATION AND METHODS OF FORMI...

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...

SEMICONDUCTOR DEVICE WITH S/D BOTTOM ISOLATION AND METHODS OF FORMI...

SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...

SEMICONDUCTOR DEVICE WITH CORNER ISOLATION PROTECTION AND METHODS O...

DEVICES WITH STRAINED ISOLATION FEATURES

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK

Semiconductor Device With Air Gaps Between Metal Gates And Method O...

Enlarged Backside Contact

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES

ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...

ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...

Semiconductor Device With Air Gaps Between Metal Gates And Method O...

Semiconductor Device with S/D Bottom Isolation and Methods of Formi...

Semiconductor Device with Corner Isolation Protection and Methods o...

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...

Transistor Structure and Method With Strain Effect

Isolation Structures In Multi-Gate Semiconductor Devices And Method...

SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATI...

Gate Cut Dielectric Feature and Method of Forming the Same

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK

Devices with Strained Isolation Features

Stress-Inducing Silicon Liner in Semiconductor Devices

Semiconductor Device with Air Gaps Between Metal Gates and Method o...