Ya Cheng Chuang

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
Coated Metal Alloy Substrate and Process for Production Thereof
- Publication number 20220349082
- Publication date Nov 3, 2022
- Hewlett-Packard Development Company, L.P.
- Qingyong Guo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS
- Publication number 20220341052
- Publication date Oct 27, 2022
- Hewlett-Packard Development Company, L.P.
- Qingyong Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...