Ya-Chun TENG

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with buffer layer and method of forming
- Patent number 11,189,653
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for bonded dies
- Patent number 10,515,908
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Chun Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006311
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-LIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SHIELDING STRUCTURE TO REDUCE CROSSTALK IN A PIXEL ARRAY
- Publication number 20220231065
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER AND METHOD OF FORMING
- Publication number 20220085090
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER AND METHOD OF FORMING
- Publication number 20210082985
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR BONDED DIES
- Publication number 20190131255
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Chun TENG
- H01 - BASIC ELECTRIC ELEMENTS