Ya-Hsi Hwung

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Copper bump structures having sidewall protection layers
- Patent number 9,093,314
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper bump structures having sidewall protection layers
- Patent number 8,922,004
- Issue date Dec 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Copper Bump Structures Having Sidewall Protection Layers
- Publication number 20150111342
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Bump Structures Having Sidewall Protection Layers
- Publication number 20110304042
- Publication date Dec 15, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS