Ya-Hui Wang

Person

Tienchin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip fabrication and packaging methods thereof
- Patent number 11,335,648
- Issue date May 17, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging structure
- Patent number 10,950,525
- Issue date Mar 16, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and fabrication and packaging methods thereof
- Patent number 10,522,479
- Issue date Dec 31, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,446,474
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foam spray head assembly
- Patent number 8,561,919
- Issue date Oct 22, 2013
- Derxin (Shanghai) Cosmetics Co., Ltd.
- Ya-Tsan Wang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Spray head assembly
- Patent number 8,439,233
- Issue date May 14, 2013
- Derxin (Shanghai) Cosmetics Co., Ltd.
- Ya-Tsan Wang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Pick-up heads and systems for die bonding and related applications
- Patent number 8,037,918
- Issue date Oct 18, 2011
- Stats Chippac, Inc.
- Ya Ping Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Charger slipcover and handheld device
- Patent number 8,035,336
- Issue date Oct 11, 2011
- Inventec Appliances Corp.
- Ya-Ping Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuit package system with support structure for die ov...
- Patent number 7,989,941
- Issue date Aug 2, 2011
- Stats Chippac Ltd.
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP FABRICATION AND PACKAGING METHODS THEREOF
- Publication number 20200098704
- Publication date Mar 26, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING STRUCTURE
- Publication number 20190393134
- Publication date Dec 26, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, AND FABRICATION AND PACKAGING METHODS THEREOF
- Publication number 20180337143
- Publication date Nov 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Hui LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180182690
- Publication date Jun 28, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTATION OF A PROCESS BASED ON A USER-DEFINED SUB-TASK SEQUENCE
- Publication number 20130247051
- Publication date Sep 19, 2013
- Fan Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and Method for CAPA Process Automation
- Publication number 20120136687
- Publication date May 31, 2012
- SAP AG
- Wei Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Foam spray head assembly
- Publication number 20120080539
- Publication date Apr 5, 2012
- DERXIN (SHANGHAI) COSMETICS CO., LTD.
- Ya-Tsan Wang
- G01 - MEASURING TESTING
Information Patent Application
Spray head assembly
- Publication number 20120080454
- Publication date Apr 5, 2012
- DERXIN (SHANGHAI) COSMETICS CO., LTD.
- Ya-Tsan Wang
- G01 - MEASURING TESTING
Information Patent Application
Liquid spray head assembly
- Publication number 20110303702
- Publication date Dec 15, 2011
- DERXIN (SHANGHAI) COSMETICS CO., LTD.
- Ya-Tsan Wang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND ME...
- Publication number 20110248391
- Publication date Oct 13, 2011
- Wei Qiang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charger Slipcover and Handheld Device
- Publication number 20100117589
- Publication date May 13, 2010
- Inventec Appliances Corp.
- Ya-Ping Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OV...
- Publication number 20090236751
- Publication date Sep 24, 2009
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automatic-reply instant messeging system and method thereof
- Publication number 20090077185
- Publication date Mar 19, 2009
- Inventec Corporation
- Chaucer Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Pick-up heads and systems for die bonding and related applications
- Publication number 20080128081
- Publication date Jun 5, 2008
- STATS ChipPAC, Inc.
- Ya Ping Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of automatic software installation in hand personal computer...
- Publication number 20020129350
- Publication date Sep 12, 2002
- INVENTEC CORPORATION
- Ya-Hui Wang
- G06 - COMPUTING CALCULATING COUNTING

Ya-Hui Wang

Person

Patents Grantslast 30 patents

Semiconductor chip fabrication and packaging methods thereof

Fabrication method of packaging structure

Semiconductor chip, and fabrication and packaging methods thereof

Packaging structure and fabrication method thereof

Foam spray head assembly

Spray head assembly

Pick-up heads and systems for die bonding and related applications

Charger slipcover and handheld device

Integrated circuit package system with support structure for die ov...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP FABRICATION AND PACKAGING METHODS THEREOF

FABRICATION METHOD OF PACKAGING STRUCTURE

SEMICONDUCTOR CHIP, AND FABRICATION AND PACKAGING METHODS THEREOF

PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF

IMPLEMENTATION OF A PROCESS BASED ON A USER-DEFINED SUB-TASK SEQUENCE

System and Method for CAPA Process Automation

Foam spray head assembly

Spray head assembly

Liquid spray head assembly

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND ME...

Charger Slipcover and Handheld Device

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OV...

Automatic-reply instant messeging system and method thereof

Pick-up heads and systems for die bonding and related applications

Method of automatic software installation in hand personal computer...