Ya-Lin Hsiao

Person

  • Taoyuan City, TW

Patents Grantslast 30 patents

  • Information Patent Grant

    Heat transferring module

    • Patent number 11,039,549
    • Issue date Jun 15, 2021
    • HTC Corporation
    • Ya-Lin Hsiao
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Electronic assembly and electronic device

    • Patent number 9,965,003
    • Issue date May 8, 2018
    • HTC Corporation
    • Ying-Yen Cheng
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Electronic device

    • Patent number 9,939,858
    • Issue date Apr 10, 2018
    • HTC Corporation
    • Hung-Wen Lin
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Electronic device and heat dissipation plate

    • Patent number 9,625,215
    • Issue date Apr 18, 2017
    • HTC Corporation
    • Ya-Lin Hsiao
    • F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

  • Information Patent Application

    HEAT TRANSFERRING MODULE

    • Publication number 20190239391
    • Publication date Aug 1, 2019
    • HTC CORPORATION
    • Ya-Lin Hsiao
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE

    • Publication number 20170010642
    • Publication date Jan 12, 2017
    • HTC CORPORATION
    • Ying-Yen Cheng
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ELECTRONIC DEVICE AND HEAT DISSIPATION PLATE

    • Publication number 20160088769
    • Publication date Mar 24, 2016
    • HTC CORPORATION
    • Ya-Lin Hsiao
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20150212558
    • Publication date Jul 30, 2015
    • HTC CORPORATION
    • Hung-Wen Lin
    • G06 - COMPUTING CALCULATING COUNTING