TREA

Ya-Ling Hung

Follow

Person

  • Hsin-Chu, TW
People

Patents Grantslast 30 patents

  • Information Patent Grant

    High bandwidth package structure
    • Patent number 12,278,166
    • Issue date Apr 15, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Harry-Haklay Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 12,272,756
    • Issue date Apr 8, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yu-Chun Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 12,261,228
    • Issue date Mar 25, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Chi-Chung Jen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetoresistive random access memory structure
    • Patent number 11,917,923
    • Issue date Feb 27, 2024
    • United Microelectronics Corp.
    • Hui-Lin Wang
  • Information Patent Grant

    Semiconductor device
    • Patent number 11,682,736
    • Issue date Jun 20, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yu-Chun Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming memory cell
    • Patent number 11,632,889
    • Issue date Apr 18, 2023
    • United Microelectronics Corp.
    • Da-Jun Lin
  • Information Patent Grant

    Semiconductor device
    • Patent number 11,563,127
    • Issue date Jan 24, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Chi-Chung Jen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming resistive random access memory cell
    • Patent number 11,189,793
    • Issue date Nov 30, 2021
    • United Microelectronics Corp.
    • Shih-Wei Su
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Memory cell and forming method thereof
    • Patent number 11,101,324
    • Issue date Aug 24, 2021
    • United Microelectronics Corp.
    • Da-Jun Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for fabricating a semiconductor device
    • Patent number 10,008,409
    • Issue date Jun 26, 2018
    • United Microelectronics Corp.
    • Chich-Neng Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and method for fabricating the same
    • Patent number 9,812,352
    • Issue date Nov 7, 2017
    • United Microelectronics Corp.
    • Chich-Neng Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method for metal gate
    • Patent number 8,486,790
    • Issue date Jul 16, 2013
    • United Microelectronics Corp.
    • Po-Cheng Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for fabricating semiconductor device
    • Patent number 8,431,473
    • Issue date Apr 30, 2013
    • United Microelectronics Corp.
    • Shu-Hui Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for manufacturing trench isolation
    • Patent number 6,303,467
    • Issue date Oct 16, 2001
    • United Microelectronics Corp.
    • Yi-Min Jen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ball grid array package
    • Patent number 6,291,898
    • Issue date Sep 18, 2001
    • Advanced Semiconductor Engineering, Inc.
    • Yung I Yeh
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250241014
    • Publication date Jul 24, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chi-Chung JEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PIXEL SENSOR ARRAYS AND METHODS OF FORMATION
    • Publication number 20240274636
    • Publication date Aug 15, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Hsien YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH BANDWIDTH PACKAGE STRUCTURE
    • Publication number 20230395466
    • Publication date Dec 7, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Harry-Haklay Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
    • Publication number 20230290748
    • Publication date Sep 14, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Harry-Hak-Lay Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230268446
    • Publication date Aug 24, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Chun SHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TESTING STRUCTURE FOR AN INTEGRATED CHIP HAVING A HIGH-VOLTAGE DEVICE
    • Publication number 20230170249
    • Publication date Jun 1, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Harry-Hak-Lay Chuang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230155036
    • Publication date May 18, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chi-Chung JEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETORESISTIVE RANDOM ACCESS MEMORY STRUCTURE
    • Publication number 20220310902
    • Publication date Sep 29, 2022
    • UNITED MICROELECTRONICS CORP.
    • Hui-Lin Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220216343
    • Publication date Jul 7, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Yu-Chun SHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220216342
    • Publication date Jul 7, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chi-Chung JEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING MEMORY CELL
    • Publication number 20210343789
    • Publication date Nov 4, 2021
    • UNITED MICROELECTRONICS CORP.
    • Da-Jun Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING RESISTIVE RANDOM ACCESS MEMORY CELL
    • Publication number 20210074917
    • Publication date Mar 11, 2021
    • UNITED MICROELECTRONICS CORP.
    • Shih-Wei Su
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY CELL AND FORMING METHOD THEREOF
    • Publication number 20200395413
    • Publication date Dec 17, 2020
    • UNITED MICROELECTRONICS CORP.
    • Da-Jun Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND MANUFACTURING METHOD...
    • Publication number 20190229053
    • Publication date Jul 25, 2019
    • UNITED MICROELECTRONICS CORP.
    • Ya-Jyuan Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
    • Publication number 20180012793
    • Publication date Jan 11, 2018
    • UNITED MICROELECTRONICS CORP.
    • Chich-Neng Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    • Publication number 20170200632
    • Publication date Jul 13, 2017
    • UNITED MICROELECTRONICS CORP.
    • Chich-Neng Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD FOR METAL GATE
    • Publication number 20130023098
    • Publication date Jan 24, 2013
    • Po-Cheng Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    • Publication number 20130009288
    • Publication date Jan 10, 2013
    • Shu-Hui Hu
    • H01 - BASIC ELECTRIC ELEMENTS