Ya-Ping Yeh

Person

  • Tainan, TW

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COVERS FOR ELECTRONIC DEVICES

    • Publication number 20240158943
    • Publication date May 16, 2024
    • Hewlett-Packard Development Company, L.P.
    • Qingyong GUO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    HOMOLOGOUS RECOMBINATION DEFICIENCY DETERMINING METHOD AND KIT THEREOF

    • Publication number 20240026462
    • Publication date Jan 25, 2024
    • WOEI-FUH WANG
    • C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

    • Publication number 20240019787
    • Publication date Jan 18, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ru-Gun LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PATTERN FIDELITY ENHANCEMENT

    • Publication number 20230369047
    • Publication date Nov 16, 2023
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Yu-Tien Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

    • Publication number 20230260803
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ya-Wen YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROSATELLITE INSTABILITY DETERMINING METHOD AND SYSTEM THEREOF

    • Publication number 20230230661
    • Publication date Jul 20, 2023
    • ACT Genomics (IP) Limited
    • YA-CHI YEH
  • Information Patent Application

    ELECTRONIC DEVICE COVERS WITH DYEING LAYERS

    • Publication number 20230189465
    • Publication date Jun 15, 2023
    • Hewlett-Packard Development Company, L.P.
    • KUAN-TING WU
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Directional Deposition for Semiconductor Fabrication

    • Publication number 20230170218
    • Publication date Jun 1, 2023
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Shih-Chun Huang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COVERS FOR ELECTRONIC DEVICES WITH A HYDROPHOBIC COATING

    • Publication number 20230034431
    • Publication date Feb 2, 2023
    • Hewlett-Packard Development Company, L.P.
    • Kuan-Ting Wu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ANTI-FINGERPRINT ENCLOSURES

    • Publication number 20220276679
    • Publication date Sep 1, 2022
    • Hewlett-Packard Development Company, L.P.
    • Kuan-Ting Wu
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    FINE LINE PATTERNING METHODS

    • Publication number 20220157605
    • Publication date May 19, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih-Chun HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AN ALLOY INJECTION MOLDED LIQUID METAL SUBSTRATE

    • Publication number 20220152649
    • Publication date May 19, 2022
    • Hewlett-Packard Development, L.P.
    • Chi Hao Chang
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Application

    COVERS FOR ELECTRONIC DEVICES

    • Publication number 20220066515
    • Publication date Mar 3, 2022
    • Hewlett-Packard Development Company, L.P.
    • KUAN-TING WU
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    COVERS FOR ELECTRONIC DEVICES

    • Publication number 20220007531
    • Publication date Jan 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Lien-Chia Chiu
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

    • Publication number 20210375639
    • Publication date Dec 2, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ya-Wen YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE HOUSING WITH METALLIC LUSTER

    • Publication number 20210363646
    • Publication date Nov 25, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chi Hao Chang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    NICKEL-FREE SEALING OF ANODIZED METAL SUBSTRATES

    • Publication number 20210363654
    • Publication date Nov 25, 2021
    • Hewlett-Packard Development Company, L.P.
    • Kuan-Ting Wu
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Directional Deposition for Semiconductor Fabrication

    • Publication number 20210358752
    • Publication date Nov 18, 2021
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Shih-Chun Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHUTTER ASSEMBLIES FOR ELECTRONIC DEVICES

    • Publication number 20210286234
    • Publication date Sep 16, 2021
    • Hewlett-Packard Development Company, L.P.
    • Ya-Ting Yeh
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Method OF FORMING METAL FEATURES

    • Publication number 20210272807
    • Publication date Sep 2, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Po-Chin Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYDRAULIC HINGE ASSEMBLIES

    • Publication number 20210165465
    • Publication date Jun 3, 2021
    • Hewlett-Packard Development Company, L.P.
    • Shih-Hsun Huang
    • E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
  • Information Patent Application

    Pattern Fidelity Enhancement

    • Publication number 20210118674
    • Publication date Apr 22, 2021
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Yu-Tien Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

    • Publication number 20210096473
    • Publication date Apr 1, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ru-Gun LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE HOUSINGS WITH GLASS BEADS

    • Publication number 20210043270
    • Publication date Feb 11, 2021
    • Hewlett-Packard Development Company, L.P.
    • KUAN-TING WU
    • G12 - INSTRUMENT DETAILS
  • Information Patent Application

    FINE LINE PATTERNING METHODS

    • Publication number 20200335340
    • Publication date Oct 22, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shih-Chun HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE HOUSINGS WITH WATERBORNE METALLIC PAINT COATINGS

    • Publication number 20200283648
    • Publication date Sep 10, 2020
    • Hewlett-Packard Development Company, L.P.
    • KUAN-TING WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECTIONAL PATTERNING METHOD

    • Publication number 20200243336
    • Publication date Jul 30, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Po-Chin Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    KICKSTAND FOR A PORTABLE ELECTRONIC DEVICE

    • Publication number 20200192429
    • Publication date Jun 18, 2020
    • Hewlett-Packard Development Company, L.P.
    • KUAN-TING WU
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SUBSTRATE(S) ENCLOSED BY ENERGY ABSORBING MATERIAL(S)

    • Publication number 20200110447
    • Publication date Apr 9, 2020
    • Hewlett-Packard Development Company, L.P.
    • Kuan-Ting Wu
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES USING DIRECTIONAL PRO...

    • Publication number 20200006085
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ya-Wen YEH
    • H01 - BASIC ELECTRIC ELEMENTS