Ya Ping ZHU

Follow

Person

Chengdu, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of bonding wire vertical interconnects
- Patent number 11,145,620
- Issue date Oct 12, 2021
- ASM Technology Singapore Pte. Ltd.
- Mow Huat Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MEASURING THE HEIGHTS OF WIRE INTERCONNECTIONS
- Publication number 20200348243
- Publication date Nov 5, 2020
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- G01 - MEASURING TESTING
Information Patent Application
FORMATION OF BONDING WIRE VERTICAL INTERCONNECTS
- Publication number 20200286855
- Publication date Sep 10, 2020
- ASM Technology Singapore Pte Ltd
- Mow Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS