Ya-Tuan Tseng

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,830,770
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 11,776,948
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 11,742,291
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier free interface between beol interconnects
- Patent number 11,694,926
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 11,362,035
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,342,222
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 11,309,307
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and methods for chemical mechanical polishing
- Patent number 10,967,480
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ya-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 10,679,980
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 10,388,645
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 10,283,496
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Barrier structures and methods for through substrate vias
- Patent number 8,704,375
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Etch Stop Region for Semiconductor Device Substrate Thinning
- Publication number 20240079239
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230411210
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
- Publication number 20230369309
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20230335499
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS
- Publication number 20230290678
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20220336269
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ching Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20220310526
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20220277991
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
- Publication number 20220246600
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS
- Publication number 20210335663
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20210287994
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20210098290
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
- Publication number 20200303366
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20200156205
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YA-HSIN TSENG
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
- Publication number 20190371783
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
- Publication number 20180358348
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
- Publication number 20180006010
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin LO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR FORMATION OF VERTICAL MICROVIAS IN OPAQUE CER...
- Publication number 20150343567
- Publication date Dec 3, 2015
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Chih WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Barrier Structures and Methods for Through Substrate Vias
- Publication number 20100193954
- Publication date Aug 5, 2010
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clean bench
- Publication number 20050048898
- Publication date Mar 3, 2005
- Ta-Kuang Chang
- B08 - CLEANING

Ya-Tuan Tseng

Person

Patents Grantslast 30 patents

Self-aligned scheme for semiconductor device and method of forming...

Integrated circuit filler and method thereof

Diffusion barrier layer for conductive via to decrease contact resi...

Barrier free interface between beol interconnects

Diffusion barrier layer for conductive via to decrease contact resi...

Self-aligned scheme for semiconductor device and method of forming...

Integrated circuit filler and method thereof

Apparatus and methods for chemical mechanical polishing

Integrated circuit filler and method thereof

Integrated circuit filler and method thereof

Integrated circuit filler and method thereof

Barrier structures and methods for through substrate vias

Patents Applicationslast 30 patents

Etch Stop Region for Semiconductor Device Substrate Thinning

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

INTEGRATED CIRCUIT FILLER AND METHOD THEREOF

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS

HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

Self-Aligned Scheme for Semiconductor Device and Method of Forming...

INTEGRATED CIRCUIT FILLER AND METHOD THEREOF

BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

Self-Aligned Scheme for Semiconductor Device and Method of Forming...

INTEGRATED CIRCUIT FILLER AND METHOD THEREOF

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

INTEGRATED CIRCUIT FILLER AND METHOD THEREOF

INTEGRATED CIRCUIT FILLER AND METHOD THEREOF

INTEGRATED CIRCUIT FILLER AND METHOD THEREOF

METHOD AND SYSTEM FOR FORMATION OF VERTICAL MICROVIAS IN OPAQUE CER...

Barrier Structures and Methods for Through Substrate Vias

Clean bench