Ya-Tzu Wu

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Bade City, TW

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Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit chip package and manufacturing method thereof
- Publication number 20120273931
- Publication date Nov 1, 2012
- Richtek Technology Corporation, R.O.C.
- Hsi-Chen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING...
- Publication number 20090212428
- Publication date Aug 27, 2009
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chips package with reduced structure and method for forming t...
- Publication number 20080197469
- Publication date Aug 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS