Ya-Yi Lai

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating package structure
- Patent number 9,524,944
- Issue date Dec 20, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,362,245
- Issue date Jun 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package with the same
- Patent number 7,019,389
- Issue date Mar 28, 2006
- Siliconware Precision Industries Co., Ltd.
- Jeng-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for chip with testing contact pad connected t...
- Patent number 6,642,735
- Issue date Nov 4, 2003
- Siliconware Precision Industries Co., Ltd.
- Lien-Chen Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Structure of disturbing plate having down set
- Patent number 6,414,379
- Issue date Jul 2, 2002
- Siliconware Precision Industries Co., Ltd.
- Yueh-Chiung Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE
- Publication number 20160247773
- Publication date Aug 25, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20140327131
- Publication date Nov 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and semiconductor package with the same
- Publication number 20050098860
- Publication date May 12, 2005
- Siliconware Precision Industries Co., Ltd.
- Jeng-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-die integrated circuit package structure and method of manufa...
- Publication number 20020109222
- Publication date Aug 15, 2002
- Ya-Yi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package for chip with testing contact pad
- Publication number 20020070747
- Publication date Jun 13, 2002
- Lien-Chen Chiang
- G01 - MEASURING TESTING