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Yabei Gu
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Pasadena, CA, US
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last 30 patents
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Patent Application
Isostatic pressure assisted wafer bonding method
Publication number
20060240640
Publication date
Oct 26, 2006
Vitali Nesterenko
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
Processing of high density magnesium boride wires and tapes by hot...
Publication number
20040245506
Publication date
Dec 9, 2004
Yuntian T. Zhu
H01 - BASIC ELECTRIC ELEMENTS