Yadong BAI

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip power supply system, chip, PCB, and computer device
- Patent number 11,387,226
- Issue date Jul 12, 2022
- Huawei Technologies Co., Ltd.
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package structure and electronic device
- Patent number 10,091,915
- Issue date Oct 2, 2018
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package structure and electronic device
- Patent number 9,839,167
- Issue date Dec 5, 2017
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and packaging method
- Patent number 9,484,311
- Issue date Nov 1, 2016
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic integration double-ended converter
- Patent number 9,160,244
- Issue date Oct 13, 2015
- Huawei Technologies Co., Ltd.
- Zengyi Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Magnetic integration double-ended converter
- Patent number 8,848,397
- Issue date Sep 30, 2014
- Huawei Technologies Co., Ltd.
- Zengyi Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
CHIP POWER SUPPLY SYSTEM, CHIP, PCB, AND COMPUTER DEVICE
- Publication number 20210143141
- Publication date May 13, 2021
- Huawei Technologies Co., Ltd
- Yadong Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20180049351
- Publication date Feb 15, 2018
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20150305210
- Publication date Oct 22, 2015
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND PACKAGING METHOD
- Publication number 20150102473
- Publication date Apr 16, 2015
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Integration Double-Ended Converter
- Publication number 20140362607
- Publication date Dec 11, 2014
- Zengyi Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER
- Publication number 20120201053
- Publication date Aug 9, 2012
- Huawei Technologies Co., Ltd
- Zengyi LU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...