Yakub Aliyu

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Ridge, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 6,821,888
- Issue date Nov 23, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a via in a damascene process
- Patent number 6,803,305
- Issue date Oct 12, 2004
- Chartered Semiconductor Manufacturing Limited
- Daniel Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing gouging during via formation
- Patent number 6,686,279
- Issue date Feb 3, 2004
- Chartered Semiconductor Manufacturing Limited
- Daniel Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing copper diffusion by doping an inorganic diele...
- Patent number 6,309,982
- Issue date Oct 30, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming a high aspect ratio via
- Publication number 20040077174
- Publication date Apr 22, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Daniel Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a via in a damascene process
- Publication number 20030194856
- Publication date Oct 16, 2003
- Daniel Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing gouging during via formation
- Publication number 20030186542
- Publication date Oct 2, 2003
- Daniel Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20030032275
- Publication date Feb 13, 2003
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS