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Patents Grants
last 30 patents
Information
Patent Grant
Wire bonder including a transducer, a bond head, and a mounting app...
Patent number
8,919,631
Issue date
Dec 30, 2014
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flanged transducer having improved rigidity
Patent number
7,997,470
Issue date
Aug 16, 2011
ASM Technology Singapore Pte. Ltd.
Hing Leung Marchy Li
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information
Patent Grant
Vacuum wire tensioner for wire bonder
Patent number
7,954,689
Issue date
Jun 7, 2011
ASM Technology Singapore Pte. Ltd.
Ka Shing Kenny Kwan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding method for forming low-loop profiles
Patent number
7,780,064
Issue date
Aug 24, 2010
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device handler for a bonding apparatus
Patent number
7,677,431
Issue date
Mar 16, 2010
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for delivering shielding gas during wire bonding
Patent number
7,628,307
Issue date
Dec 8, 2009
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device handler for a bonding apparatus
Patent number
7,568,606
Issue date
Aug 4, 2009
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming low wire loops and wire loops formed using the me...
Patent number
7,494,042
Issue date
Feb 24, 2009
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bond with improved shear strength
Patent number
7,314,157
Issue date
Jan 1, 2008
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stud bumping apparatus
Patent number
7,303,109
Issue date
Dec 4, 2007
ASM Technology Singapore Pte. Ltd.
Ka Shing Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a wire bond with multiple stitch bonds
Patent number
7,214,606
Issue date
May 8, 2007
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capillary holder
Patent number
7,100,812
Issue date
Sep 5, 2006
ASM Technology Singapore Pte. Ltd.
Bao Nian Zhai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple-ball wire bonds
Patent number
7,064,433
Issue date
Jun 20, 2006
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bondhead for wire bonding apparatus
Patent number
7,025,243
Issue date
Apr 11, 2006
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method to prevent oxidation of electronic devices
Patent number
6,866,182
Issue date
Mar 15, 2005
ASM Technology Singapore PTE LTD
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for detecting the oscillation amplitude of an oscillating...
Patent number
6,827,247
Issue date
Dec 7, 2004
ASM Technology Singapore PTE LTD
Liming Fan
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple-head wire-bonding system
Patent number
6,749,100
Issue date
Jun 15, 2004
ASM Technology Singapore PTE LTD
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of bonding wires
Patent number
6,672,503
Issue date
Jan 6, 2004
ASM Technology Singapore PTE LTD
Siu Wing Or
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of and apparatus for monitoring a ball forming process
Patent number
6,660,956
Issue date
Dec 9, 2003
ASM Technology Singapore PTE
Michael Armin Boller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding system
Patent number
6,572,001
Issue date
Jun 3, 2003
ASM Technology Singapore Pte. Ltd.
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APP...
Publication number
20130240605
Publication date
Sep 19, 2013
Yam Mo WONG
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information
Patent Application
VACUUM WIRE TENSIONER FOR WIRE BONDER
Publication number
20080272178
Publication date
Nov 6, 2008
Ka Shing Kenny KWAN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLANGED TRANSDUCER HAVING IMPROVED RIGIDITY
Publication number
20080121679
Publication date
May 29, 2008
Hing Leung Marchy LI
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information
Patent Application
APPARATUS FOR DELIVERING SHIELDING GAS DURING WIRE BONDING
Publication number
20080099531
Publication date
May 1, 2008
Yam Mo WONG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE HANDLER FOR A BONDING APPARATUS
Publication number
20080092370
Publication date
Apr 24, 2008
Yam Mo WONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE HANDLER FOR A BONDING APPARATUS
Publication number
20080093004
Publication date
Apr 24, 2008
ASM Technology Singapore Pte Ltd
Yam Mo WONG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE BONDING METHOD FOR FORMING LOW-LOOP PROFILES
Publication number
20070284416
Publication date
Dec 13, 2007
Yam Mo WONG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CAPILLARY HOLDER
Publication number
20060175377
Publication date
Aug 10, 2006
ASM Technology Singapore Pte Ltd
Bao Nian Zhai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire bond with improved shear strength
Publication number
20060032894
Publication date
Feb 16, 2006
ASM Technology Singapore Pte Ltd
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bondhead for wire bonding apparatus
Publication number
20050279805
Publication date
Dec 22, 2005
ASM Technology Singapore Pte Ltd
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire bond with multiple stitch bonds
Publication number
20050202621
Publication date
Sep 15, 2005
ASM Technology Singapore Pte Ltd
Yam Mo Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple-ball wire bonds
Publication number
20050191839
Publication date
Sep 1, 2005
ASM Technology Singapore Pte Ltd
Yam Mo Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming low wire loops and wire loops formed using the me...
Publication number
20050072833
Publication date
Apr 7, 2005
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stud bumping apparatus
Publication number
20050001018
Publication date
Jan 6, 2005
ASM Technology Singapore Pte Ltd
Ka Shing Kenny Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method to prevent oxidation of electronic devices
Publication number
20040065720
Publication date
Apr 8, 2004
ASM Technology Singapore Pte Ltd
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multiple-head wire-bonding system
Publication number
20030098340
Publication date
May 29, 2003
ASM Technology Singapore Pte Ltd
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding system
Publication number
20030006266
Publication date
Jan 9, 2003
ASM Technology Singapore Pte Ltd
Yam M. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of bonding wires
Publication number
20020060239
Publication date
May 23, 2002
ASM Technology Singapore Pte Ltd
Siu Wing Or
H01 - BASIC ELECTRIC ELEMENTS