Yan-Chih Lu

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensing pixel, image sensor and method of fabricating the same
- Patent number 11,335,716
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal block and bond pad structure
- Patent number 11,088,192
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor pickup region layout
- Patent number 10,490,580
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal block and bond pad structure
- Patent number 10,297,631
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor pickup region layout
- Patent number 9,865,630
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond using a copper alloy for yield improvement
- Patent number 9,728,521
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor pickup region layout
- Patent number 9,391,101
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding and apparatus for performing the same
- Patent number 9,331,032
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSING PIXEL, IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20220246654
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSING PIXEL, IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20210193712
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BLOCK AND BOND PAD STRUCTURE
- Publication number 20180342552
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PICKUP REGION LAYOUT
- Publication number 20180151613
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Block and Bond Pad Structure
- Publication number 20170221950
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT
- Publication number 20170025381
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Pickup Region Layout
- Publication number 20160322407
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Pickup Region Layout
- Publication number 20150123233
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dun-Nian Yaung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding and Apparatus for Performing the Same
- Publication number 20140256087
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Yan-Chih Lu

Person

Patents Grantslast 30 patents

Photosensing pixel, image sensor and method of fabricating the same

Metal block and bond pad structure

Image sensor pickup region layout

Metal block and bond pad structure

Image sensor pickup region layout

Hybrid bond using a copper alloy for yield improvement

Image sensor pickup region layout

Hybrid bonding and apparatus for performing the same

Patents Applicationslast 30 patents

PHOTOSENSING PIXEL, IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

PHOTOSENSING PIXEL, IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

METAL BLOCK AND BOND PAD STRUCTURE

IMAGE SENSOR PICKUP REGION LAYOUT

Metal Block and Bond Pad Structure

HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT

Image Sensor Pickup Region Layout

Image Sensor Pickup Region Layout

Hybrid Bonding and Apparatus for Performing the Same