Yan Ding

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Essex Junction, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Embedding semiconductor devices in silicon-on-insulator wafers conn...
- Patent number 9,412,736
- Issue date Aug 9, 2016
- GLOBALFOUNDRIES Inc.
- Yan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through printed circuit board (PCB) vias
- Patent number 9,408,304
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Dana H. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Marchand balun structure and design method
- Patent number 9,059,494
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Hanyi Ding
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDING SEMICONDUCTOR DEVICES IN SILICON-ON-INSULATOR WAFERS CONN...
- Publication number 20150357325
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Yan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PRINTED CIRCUIT BOARD (PCB) VIAS
- Publication number 20150208502
- Publication date Jul 23, 2015
- International Business Machines Corporation
- Dana H. BROWN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MARCHAND BALUN STRUCTURE AND DESIGN METHOD
- Publication number 20140203885
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS