Yan Dong Sun

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus comprising an oscillator mechanism
- Patent number 9,640,512
- Issue date May 2, 2017
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS COMPRISING AN OSCILLATOR MECHANISM
- Publication number 20160023298
- Publication date Jan 28, 2016
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR