Yan-Heng Chen

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for detecting positions of wafers
- Patent number 11,721,573
- Issue date Aug 8, 2023
- Hiwin Technologies Corp.
- Yan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of electronic package
- Patent number 10,403,567
- Issue date Sep 3, 2019
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 9,899,303
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,842,758
- Issue date Dec 12, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure
- Patent number 9,768,140
- Issue date Sep 19, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,666,536
- Issue date May 30, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via structure and fabrication method thereof
- Patent number 9,607,941
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 9,589,841
- Issue date Mar 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof and carrier st...
- Patent number 9,548,219
- Issue date Jan 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,515,040
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package having embedded semicon...
- Patent number 9,397,081
- Issue date Jul 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,337,061
- Issue date May 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 9,224,646
- Issue date Dec 29, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having embedded semiconductor elements
- Patent number 9,177,859
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,117,698
- Issue date Aug 25, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light-emitting diode structure and manufacturing method t...
- Patent number 8,859,311
- Issue date Oct 14, 2014
- Lextar Electronics Corporation
- Chia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, package structure and fabrication method the...
- Patent number 8,829,672
- Issue date Sep 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,828,796
- Issue date Sep 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Chieh-Yuan Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Detecting Positions of Wafers
- Publication number 20220059382
- Publication date Feb 24, 2022
- Hiwin Technologies Corp.
- Yan-Yu Chen
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF ELECTRONIC PACKAGE
- Publication number 20180130727
- Publication date May 10, 2018
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20170236783
- Publication date Aug 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160240466
- Publication date Aug 18, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160190099
- Publication date Jun 30, 2016
- Siliconware Precision Industries Co., Ltd.
- Yi-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICON...
- Publication number 20160141281
- Publication date May 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160126126
- Publication date May 5, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160111359
- Publication date Apr 21, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE
- Publication number 20160049376
- Publication date Feb 18, 2016
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160013146
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND CARRIER ST...
- Publication number 20150325508
- Publication date Nov 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150294938
- Publication date Oct 15, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140342505
- Publication date Nov 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20140342506
- Publication date Nov 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140342507
- Publication date Nov 20, 2014
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140332976
- Publication date Nov 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140183721
- Publication date Jul 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20140134797
- Publication date May 15, 2014
- Siliconware Precision Industries Co., Ltd.
- Chieh-Yuan Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP LIGHT-EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20140061700
- Publication date Mar 6, 2014
- Lextar Electronics Corporation
- Chia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20130256875
- Publication date Oct 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Yan-Heng Chen

Person

Patents Grantslast 30 patents

Method and apparatus for detecting positions of wafers

Fabrication method of electronic package

Electronic package and fabrication method thereof

Package structure and fabrication method thereof

Method for fabricating package structure

Package structure and fabrication method thereof

Conductive via structure and fabrication method thereof

Electronic package and fabrication method thereof

Semiconductor package and fabrication method thereof and carrier st...

Package structure and fabrication method thereof

Fabrication method of semiconductor package having embedded semicon...

Fabrication method of semiconductor package

Method for fabricating semiconductor package

Semiconductor package having embedded semiconductor elements

Fabrication method of semiconductor package

Flip-chip light-emitting diode structure and manufacturing method t...

Semiconductor package, package structure and fabrication method the...

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

Method and Apparatus for Detecting Positions of Wafers

FABRICATION METHOD OF ELECTRONIC PACKAGE

PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICON...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND CARRIER ST...

CONDUCTIVE VIA STRUCTURE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

FLIP-CHIP LIGHT-EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD T...

SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THE...