Yan Huo

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 10,043,736
- Issue date Aug 7, 2018
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thick bottom metal and preparation method...
- Patent number 9,653,383
- Issue date May 16, 2017
- Alpha & Omega Semiconductor (Cayman), Ltd.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 9,646,920
- Issue date May 9, 2017
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of hybrid packaging a lead frame based multi-chip semiconduc...
- Patent number 9,425,181
- Issue date Aug 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin semiconductor device and preparation method thereof
- Patent number 9,337,127
- Issue date May 10, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and the preparation method
- Patent number 9,337,131
- Issue date May 10, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-exposed semiconductor package and the manufacturing method
- Patent number 9,245,831
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor (Cayman) LTD
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin semiconductor device and preparation method thereof
- Patent number 9,117,809
- Issue date Aug 25, 2015
- Alpha & Omega Semiconductor (Cayman), Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thick bottom metal and preparation method...
- Patent number 9,087,828
- Issue date Jul 21, 2015
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 9,054,091
- Issue date Jun 9, 2015
- Alpha & Omega Semiconductor, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloy lead-frame and its use in fabrication of power semic...
- Patent number 8,703,545
- Issue date Apr 22, 2014
- Alpha & Omega Semiconductor, Inc.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20170186675
- Publication date Jun 29, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...
- Publication number 20160315039
- Publication date Oct 27, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD
- Publication number 20160093560
- Publication date Mar 31, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20150357268
- Publication date Dec 10, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20150325500
- Publication date Nov 12, 2015
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan - Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICK BOTTOM METAL AND PREPARATION METHOD...
- Publication number 20150279766
- Publication date Oct 1, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20150255377
- Publication date Sep 10, 2015
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconduc...
- Publication number 20150236005
- Publication date Aug 20, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION ME...
- Publication number 20140361420
- Publication date Dec 11, 2014
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Thick Bottom Metal and Preparation Method...
- Publication number 20140264802
- Publication date Sep 18, 2014
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMIC...
- Publication number 20130221507
- Publication date Aug 29, 2013
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power semiconductor device with small contact footprint and the pre...

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Semiconductor device with thick bottom metal and preparation method...

Power semiconductor device with small contact footprint and the pre...

Method of hybrid packaging a lead frame based multi-chip semiconduc...

Ultra-thin semiconductor device and preparation method thereof

Power semiconductor device and the preparation method

Top-exposed semiconductor package and the manufacturing method

Ultra-thin semiconductor device and preparation method thereof

Semiconductor device with thick bottom metal and preparation method...

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Aluminum alloy lead-frame and its use in fabrication of power semic...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...

POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

ULTRA-THIN SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH THICK BOTTOM METAL AND PREPARATION METHOD...

ULTRA-THIN SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF

Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconduc...

HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION ME...

Semiconductor Device with Thick Bottom Metal and Preparation Method...

ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMIC...