TREA

Yan Lee

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  • Shanghai, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Heat sink and housing assembly
    • Patent number 11,988,468
    • Issue date May 21, 2024
    • Tyco Electronics (Shanghai) Co., Ltd.
    • WenYu Liu
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat sink and housing assembly
    • Patent number 11,262,140
    • Issue date Mar 1, 2022
    • Tyco Electronics (Shanghai) Co. Ltd.
    • WenYu Liu
    • F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

  • Information Patent Application

    Heat Sink And Housing Assembly
    • Publication number 20200103180
    • Publication date Apr 2, 2020
    • Tyco Electronics (Shanghai) Co. Ltd.
    • WenYu Liu
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Heat Sink And Housing Assembly
    • Publication number 20200103181
    • Publication date Apr 2, 2020
    • Tyco Electronics (Shanghai) Co. Ltd.
    • WenYu Liu
    • F28 - HEAT EXCHANGE IN GENERAL