Yan Ting SHEN

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer supporting mechanism and method for wafer dicing
- Patent number 12,112,965
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Bo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer supporting mechanism and method for wafer dicing
- Patent number 11,587,809
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 11,189,518
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
- Publication number 20230197487
- Publication date Jun 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230037117
- Publication date Feb 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
- Publication number 20220102176
- Publication date Mar 31, 2022
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20210151342
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting SHEN
- H01 - BASIC ELECTRIC ELEMENTS