Yan Yang Zhao

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multichannel RF feedthroughs
- Patent number 10,845,553
- Issue date Nov 24, 2020
- II-VI Delaware Inc.
- Yan yang Zhao
- G02 - OPTICS
Information Patent Grant
Flex-less multilayer ceramic substrate
- Patent number 9,900,974
- Issue date Feb 20, 2018
- Finisar Corporation
- Wenhua Ling
- G02 - OPTICS
Information Patent Grant
Multichannel RF feedthroughs
- Patent number 9,538,637
- Issue date Jan 3, 2017
- Finisar Corporation
- Yan yang Zhao
- G02 - OPTICS
Information Patent Grant
High-speed interconnects
- Patent number 7,978,030
- Issue date Jul 12, 2011
- Finisar Corporation
- Yuheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feed thru with flipped signal plane using guided vias
- Patent number 7,880,570
- Issue date Feb 1, 2011
- Finisar Corporation
- Jianying Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-coplanar high-speed interconnects
- Patent number 7,859,367
- Issue date Dec 28, 2010
- Finisar Corporation
- Yan Yang Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE
- Publication number 20220254707
- Publication date Aug 11, 2022
- SAMTEC, INC.
- Chihhao CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE
- Publication number 20210028140
- Publication date Jan 28, 2021
- SAMTEC, INC.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX-LESS MULTILAYER CERAMIC SUBSTRATE
- Publication number 20170354026
- Publication date Dec 7, 2017
- Finisar Corporation
- Wenhua Ling
- G02 - OPTICS
Information Patent Application
MULTICHANNEL RF FEEDTHROUGHS
- Publication number 20170176700
- Publication date Jun 22, 2017
- Finisar Corporation
- Yan yang Zhao
- G02 - OPTICS
Information Patent Application
MULTICHANNEL RF FEEDTHROUGHS
- Publication number 20130001410
- Publication date Jan 3, 2013
- Finisar Corporation
- Yan yang Zhao
- G02 - OPTICS
Information Patent Application
FEED THRU WITH FLIPPED SIGNAL PLANE USING GUIDED VIAS
- Publication number 20090267712
- Publication date Oct 29, 2009
- Finisar Corporation
- Jianying Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-COPLANAR HIGH-SPEED INTERCONNECTS
- Publication number 20090033442
- Publication date Feb 5, 2009
- Finisar Corporation
- Yan Yang Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED INTERCONNECTS
- Publication number 20080191818
- Publication date Aug 14, 2008
- Finisar Corporation
- Yuheng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Yan Yang Zhao

Person

Patents Grantslast 30 patents

Multichannel RF feedthroughs

Flex-less multilayer ceramic substrate

Multichannel RF feedthroughs

High-speed interconnects

Feed thru with flipped signal plane using guided vias

Non-coplanar high-speed interconnects

Patents Applicationslast 30 patents

WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE

WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE

FLEX-LESS MULTILAYER CERAMIC SUBSTRATE

MULTICHANNEL RF FEEDTHROUGHS

MULTICHANNEL RF FEEDTHROUGHS

FEED THRU WITH FLIPPED SIGNAL PLANE USING GUIDED VIAS

NON-COPLANAR HIGH-SPEED INTERCONNECTS

HIGH-SPEED INTERCONNECTS