Yan-Yi Liao

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of semiconductor package having embedded semicon...
- Patent number 9,397,081
- Issue date Jul 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,337,061
- Issue date May 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having embedded semiconductor elements
- Patent number 9,177,859
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICON...
- Publication number 20160141281
- Publication date May 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140342505
- Publication date Nov 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140332976
- Publication date Nov 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140183721
- Publication date Jul 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS