Yana CHENG

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to predict yield of a device manufacturing process
- Patent number 12,055,904
- Issue date Aug 6, 2024
- ASML Netherlands B.V.
- Youping Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing devices
- Patent number 12,044,980
- Issue date Jul 23, 2024
- ASML Netherlands B.V.
- Abraham Slachter
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for controlling a manufacturing process and associated appar...
- Patent number 11,947,266
- Issue date Apr 2, 2024
- ASML Netherlands B.V.
- Nicolaas Petrus Marcus Brantjes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for determining root cause affecting yield in a semiconducto...
- Patent number 11,803,127
- Issue date Oct 31, 2023
- ASML Netherlands B.V.
- Chenxi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining corrections for lithographic apparatus
- Patent number 11,754,931
- Issue date Sep 12, 2023
- ASML Netherlands B.V.
- Roy Werkman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Methods and apparatus for substrate edge uniformity
- Patent number 11,056,325
- Issue date Jul 6, 2021
- Applied Materials, Inc.
- Thanh X. Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,707,122
- Issue date Jul 7, 2020
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for thin film material deposition using reactive plasma-fre...
- Patent number 10,665,426
- Issue date May 26, 2020
- Applied Materials, Inc.
- Yana Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to reduce trap-induced capacitance in interconnect dielectri...
- Patent number 10,546,742
- Issue date Jan 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce trap-induced capacitance in interconnect dielectri...
- Patent number 10,170,299
- Issue date Jan 1, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing dielectric barrier layers and aluminum conta...
- Patent number 10,109,520
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- Sree Rangasai V. Kesapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of formation
- Patent number 9,984,976
- Issue date May 29, 2018
- Applied Materials, Inc.
- Yana Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing dielectric films via physical vapor depositi...
- Patent number 9,633,839
- Issue date Apr 25, 2017
- Applied Materials, Inc.
- Weimin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric/metal barrier integration to prevent copper diffusion
- Patent number 9,601,431
- Issue date Mar 21, 2017
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming passivation protection for an interconnection s...
- Patent number 9,299,605
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODELING METHOD FOR COMPUTATIONAL FINGERPRINTS
- Publication number 20220291590
- Publication date Sep 15, 2022
- ASML NETHERLANDS B.V.
- Jing SU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR DETERMINING CORRECTIONS FOR LITHOGRAPHIC APPARATUS
- Publication number 20220252988
- Publication date Aug 11, 2022
- ASML NETHERLANDS B.V.
- Roy WERKMAN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPAR...
- Publication number 20220026810
- Publication date Jan 27, 2022
- ASML NETHERLANDS B.V.
- Nicolaas Petrus Marcus BRANTJES
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD TO PREDICT YIELD OF A DEVICE MANUFACTURING PROCESS
- Publication number 20220011728
- Publication date Jan 13, 2022
- ASML NETHERLANDS B.V.
- Youping ZHANG
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD OF MANUFACTURING DEVICES
- Publication number 20210397172
- Publication date Dec 23, 2021
- ASML NETHERLANDS B.V.
- Abraham SLACHTER
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD FOR DETERMINING ROOT CAUSE AFFECTING YIELD IN A SEMICONDUCTO...
- Publication number 20210389677
- Publication date Dec 16, 2021
- ASML NETHERLANDS B.V.
- Chenxi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...
- Publication number 20190189433
- Publication date Jun 20, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE EDGE UNIFORMITY
- Publication number 20190189407
- Publication date Jun 20, 2019
- Applied Materials, Inc.
- THANH X. NGUYEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20190027403
- Publication date Jan 24, 2019
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR THIN FILM MATERIAL DEPOSITION USING REACTIVE PLASMA-FRE...
- Publication number 20170125215
- Publication date May 4, 2017
- Applied Materials, Inc.
- Yana CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...
- Publication number 20170098575
- Publication date Apr 6, 2017
- Applied Materials, Inc.
- Sree Rangasai V. KESAPRAGADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...
- Publication number 20170005041
- Publication date Jan 5, 2017
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC FILMS VIA PHYSICAL VAPOR DEPOSITI...
- Publication number 20160372319
- Publication date Dec 22, 2016
- Applied Materials, Inc.
- Weimin ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FORMATION
- Publication number 20160240483
- Publication date Aug 18, 2016
- Applied Materials, Inc.
- YANA CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PASSIVATION PROTECTION FOR AN INTERCONNECTION S...
- Publication number 20150255329
- Publication date Sep 10, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION
- Publication number 20150221596
- Publication date Aug 6, 2015
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method to predict yield of a device manufacturing process

Method of manufacturing devices

Method for controlling a manufacturing process and associated appar...

Method for determining root cause affecting yield in a semiconducto...

Method for determining corrections for lithographic apparatus

Methods and apparatus for substrate edge uniformity

Methods for depositing dielectric barrier layers and aluminum conta...

Methods for thin film material deposition using reactive plasma-fre...

Method to reduce trap-induced capacitance in interconnect dielectri...

Method to reduce trap-induced capacitance in interconnect dielectri...

Methods for depositing dielectric barrier layers and aluminum conta...

Interconnect structures and methods of formation

Methods for depositing dielectric films via physical vapor depositi...

Dielectric/metal barrier integration to prevent copper diffusion

Methods for forming passivation protection for an interconnection s...

Patents Applicationslast 30 patents

MODELING METHOD FOR COMPUTATIONAL FINGERPRINTS

METHOD FOR DETERMINING CORRECTIONS FOR LITHOGRAPHIC APPARATUS

METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPAR...

METHOD TO PREDICT YIELD OF A DEVICE MANUFACTURING PROCESS

METHOD OF MANUFACTURING DEVICES

METHOD FOR DETERMINING ROOT CAUSE AFFECTING YIELD IN A SEMICONDUCTO...

METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...

METHODS AND APPARATUS FOR SUBSTRATE EDGE UNIFORMITY

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

METHODS FOR THIN FILM MATERIAL DEPOSITION USING REACTIVE PLASMA-FRE...

METHODS FOR DEPOSITING DIELECTRIC BARRIER LAYERS AND ALUMINUM CONTA...

METHOD TO REDUCE TRAP-INDUCED CAPACITANCE IN INTERCONNECT DIELECTRI...

METHODS FOR DEPOSITING DIELECTRIC FILMS VIA PHYSICAL VAPOR DEPOSITI...

INTERCONNECT STRUCTURES AND METHODS OF FORMATION

METHODS FOR FORMING PASSIVATION PROTECTION FOR AN INTERCONNECTION S...

DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION