Yanfeng CHEN

Person

San Ramon, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer thin-film coatings for system-in-package assemblies in...
- Patent number 11,266,010
- Issue date Mar 1, 2022
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,966,321
- Issue date Mar 30, 2021
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,709,018
- Issue date Jul 7, 2020
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package including opposing circuit boards
- Patent number 10,356,903
- Issue date Jul 16, 2019
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package devices with magnetic shielding
- Patent number 10,147,685
- Issue date Dec 4, 2018
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer thin-film coatings for system-in-package assemblies in...
- Patent number 9,949,359
- Issue date Apr 17, 2018
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding structures for system-in-package assemblies in portable e...
- Patent number 9,913,412
- Issue date Mar 6, 2018
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to improve LiCoO2 morphology in thin film batteries
- Patent number 9,899,661
- Issue date Feb 20, 2018
- Apple Inc.
- Lili Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240074066
- Publication date Feb 29, 2024
- Apple Inc.
- Nitesh KUMBHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20200375033
- Publication date Nov 26, 2020
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20200154561
- Publication date May 14, 2020
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20190306979
- Publication date Oct 3, 2019
- Apple Inc.
- Yanfeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20180220525
- Publication date Aug 2, 2018
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System-in-Package Devices With Magnetic Shielding
- Publication number 20170263569
- Publication date Sep 14, 2017
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20150271911
- Publication date Sep 24, 2015
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING STRUCTURES FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE E...
- Publication number 20150271959
- Publication date Sep 24, 2015
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method to Improve LiCoO2 Morphology in Thin Film Batteries
- Publication number 20140272560
- Publication date Sep 18, 2014
- Apple Inc.
- Lili Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yanfeng CHEN

Person

Patents Grantslast 30 patents

Multi-layer thin-film coatings for system-in-package assemblies in...

System-in-package including opposing circuit boards

System-in-package including opposing circuit boards

System-in-package including opposing circuit boards

System-in-package devices with magnetic shielding

Multi-layer thin-film coatings for system-in-package assemblies in...

Shielding structures for system-in-package assemblies in portable e...

Method to improve LiCoO2 morphology in thin film batteries

Patents Applicationslast 30 patents

TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING

SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

System-in-Package Devices With Magnetic Shielding

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

SHIELDING STRUCTURES FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE E...

Method to Improve LiCoO2 Morphology in Thin Film Batteries