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Chandler, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Microelectronics package comprising a package-on-package (PoP) arch...
Patent number
12,347,743
Issue date
Jul 1, 2025
Intel Corporation
Elizabeth Nofen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
Patent number
12,315,777
Issue date
May 27, 2025
Intel Corporation
Elizabeth Nofen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier structures for underfill containment
Patent number
12,002,727
Issue date
Jun 4, 2024
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240128152
Publication date
Apr 18, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240021493
Publication date
Jan 18, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240014097
Publication date
Jan 11, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT
Publication number
20210249322
Publication date
Aug 12, 2021
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20210066155
Publication date
Mar 4, 2021
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE
Publication number
20200006169
Publication date
Jan 2, 2020
Intel Corporation
William WARREN
H01 - BASIC ELECTRIC ELEMENTS