Yang GUO

Follow

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier structures for underfill containment
- Patent number 12,002,727
- Issue date Jun 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT
- Publication number 20210249322
- Publication date Aug 12, 2021
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE
- Publication number 20200006169
- Publication date Jan 2, 2020
- Intel Corporation
- William WARREN
- H01 - BASIC ELECTRIC ELEMENTS