Yang-Hai Fan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Display device including active element comprising TFTS with gate i...
- Patent number 12,094,981
- Issue date Sep 17, 2024
- Au Optronics Corporation
- Yang-Shun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor
- Patent number 11,764,302
- Issue date Sep 19, 2023
- Au Optronics Corporation
- Yang-Shun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet processing apparatuses
- Patent number 8,871,032
- Issue date Oct 28, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuang-Nian Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet processing apparatuses
- Patent number 8,460,478
- Issue date Jun 11, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuang-Nian Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,816,169
- Issue date Oct 19, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,485,906
- Issue date Feb 3, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-tank etch method for oxide thickness control
- Patent number 7,405,165
- Issue date Jul 29, 2008
- Taiwan Semiconductor Manufacturing Co, Ltd.
- Yang Kai Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 7,183,598
- Issue date Feb 27, 2007
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process to increase bump height and to create a more robust...
- Patent number 6,956,292
- Issue date Oct 18, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form very a fine pitch solder bump using methods of elect...
- Patent number 6,936,923
- Issue date Aug 30, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 6,876,049
- Issue date Apr 5, 2005
- Taiwan Semiconductor Manufacturing Co.
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic fabrication with corrosion inhibited bond pad
- Patent number 6,765,277
- Issue date Jul 20, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer photoresist method for fabricating a mushroom bumping pl...
- Patent number 6,649,507
- Issue date Nov 18, 2003
- Taiwan Semiconductor Manufacturing Company
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a color image sensor cell while protecting the bondi...
- Patent number 6,632,700
- Issue date Oct 14, 2003
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process to increase bump height and to create a more robust...
- Patent number 6,605,524
- Issue date Aug 12, 2003
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dual-layer polyimide processing on bumping technology
- Patent number 6,586,323
- Issue date Jul 1, 2003
- Taiwan Semiconductor Manufacturing Company
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bump on a copper pad
- Patent number 6,583,039
- Issue date Jun 24, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-microlens design for semiconductor imaging devices to increas...
- Patent number 6,495,813
- Issue date Dec 17, 2002
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve robust solder bump height
- Patent number 6,486,054
- Issue date Nov 26, 2002
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colors only process to reduce package yield loss
- Patent number 6,482,669
- Issue date Nov 19, 2002
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bumping and backlapping a semiconductor wafer
- Patent number 6,426,283
- Issue date Jul 30, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form bump in bumping technology
- Patent number 6,426,281
- Issue date Jul 30, 2002
- Taiwan Semiconductor Manufacturing Company
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for under bump metal patterning of bumping process
- Patent number 6,372,545
- Issue date Apr 16, 2002
- Taiwan Semiconductor Manufacturing Company
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency color filter process for semiconductor array imagin...
- Patent number 6,274,917
- Issue date Aug 14, 2001
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adding plasma treatment on bond pad to prevent bond pad...
- Patent number 6,214,717
- Issue date Apr 10, 2001
- Taiwan Semiconductor Manufacturing Company
- Chao-Yi Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color filter image array optoelectronic microelectronic fabrication...
- Patent number 6,200,712
- Issue date Mar 13, 2001
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- G02 - OPTICS
Information Patent Grant
High efficiency color filter process for semiconductor array imagin...
- Patent number 6,171,885
- Issue date Jan 9, 2001
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image array optoelectronic microelectronic fabrication with enhance...
- Patent number 6,171,883
- Issue date Jan 9, 2001
- Taiwan Semiconductor Manufacturing Company
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of uniform areal sensitivity image array
- Patent number 6,168,966
- Issue date Jan 2, 2001
- Taiwan Semiconductor Manufacturing Company
- Yang Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187454
- Publication date Jun 15, 2023
- AUO Corporation
- Yang-Shun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187559
- Publication date Jun 15, 2023
- AUO Corporation
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187555
- Publication date Jun 15, 2023
- AUO Corporation
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187455
- Publication date Jun 15, 2023
- AUO Corporation
- Yang-Shun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR
- Publication number 20230084510
- Publication date Mar 16, 2023
- AU OPTRONICS CORPORATION
- Yang-Shun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20220231170
- Publication date Jul 21, 2022
- AU OPTRONICS CORPORATION
- Yang-Shun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING APPARATUSES
- Publication number 20130263900
- Publication date Oct 10, 2013
- Kuang-Nian Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF IN-SITU IDENTIFICATION FOR CONTAMINATION CO...
- Publication number 20100279438
- Publication date Nov 4, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su Chao An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS
- Publication number 20090111208
- Publication date Apr 30, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Yang-Tung FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING APPARATUSES
- Publication number 20080295874
- Publication date Dec 4, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuang-Nian Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCEDURE CONTROL METHOD FOR SIMPLEX SYSTEM
- Publication number 20080104651
- Publication date May 1, 2008
- Young Optics Inc.
- Yang-Hsin Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Systems and methods of controlling systems
- Publication number 20070190474
- Publication date Aug 16, 2007
- Chao An Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Colors only process to reduce package yield loss
- Publication number 20070120155
- Publication date May 31, 2007
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-tank etch method for oxide thickness control
- Publication number 20060099818
- Publication date May 11, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang Kai Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Colors only process to reduce package yield loss
- Publication number 20050121737
- Publication date Jun 9, 2005
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pedestal/heater assembly lift mechanism with direct drive lead screw
- Publication number 20040179933
- Publication date Sep 16, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hsi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process to increase bump height and to create a more robust...
- Publication number 20040005771
- Publication date Jan 8, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch chamber equipped with multi-layer insert ring
- Publication number 20040000375
- Publication date Jan 1, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Hsing Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic fabrication with corrosion inhibited bond pad
- Publication number 20030132497
- Publication date Jul 17, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Colors only process to reduce package yield loss
- Publication number 20030124763
- Publication date Jul 3, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yang-Tung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A BUMP ON A COPPER PAD
- Publication number 20030073300
- Publication date Apr 17, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form bump in bumping technology
- Publication number 20020127836
- Publication date Sep 12, 2002
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kuo-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUMPING AND BACKLAPPING A SEMICONDUCTOR WAFER
- Publication number 20020068425
- Publication date Jun 6, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Yang-Hai Fan

Person

Patents Grantslast 30 patents

Display device including active element comprising TFTS with gate i...

Thin film transistor

Wet processing apparatuses

Wet processing apparatuses

Colors only process to reduce package yield loss

Colors only process to reduce package yield loss

Dual-tank etch method for oxide thickness control

Colors only process to reduce package yield loss

Bumping process to increase bump height and to create a more robust...

Method to form very a fine pitch solder bump using methods of elect...

Colors only process to reduce package yield loss

Microelectronic fabrication with corrosion inhibited bond pad

Dual layer photoresist method for fabricating a mushroom bumping pl...

Method to form a color image sensor cell while protecting the bondi...

Bumping process to increase bump height and to create a more robust...

Method for dual-layer polyimide processing on bumping technology

Method of forming a bump on a copper pad

Multi-microlens design for semiconductor imaging devices to increas...

Method to achieve robust solder bump height

Colors only process to reduce package yield loss

Method for bumping and backlapping a semiconductor wafer

Method to form bump in bumping technology

Method for under bump metal patterning of bumping process

High efficiency color filter process for semiconductor array imagin...

Method for adding plasma treatment on bond pad to prevent bond pad...

Color filter image array optoelectronic microelectronic fabrication...

High efficiency color filter process for semiconductor array imagin...

Image array optoelectronic microelectronic fabrication with enhance...

Fabrication of uniform areal sensitivity image array

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ACTIVE DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF

THIN FILM TRANSISTOR

ACTIVE ELEMENT AND MANUFACTURING METHOD THEREOF

WET PROCESSING APPARATUSES

APPARATUS AND METHOD OF IN-SITU IDENTIFICATION FOR CONTAMINATION CO...

COLORS ONLY PROCESS TO REDUCE PACKAGE YIELD LOSS

WET PROCESSING APPARATUSES

PROCEDURE CONTROL METHOD FOR SIMPLEX SYSTEM

Systems and methods of controlling systems

Colors only process to reduce package yield loss

Dual-tank etch method for oxide thickness control

Colors only process to reduce package yield loss

Pedestal/heater assembly lift mechanism with direct drive lead screw

Bumping process to increase bump height and to create a more robust...

Plasma etch chamber equipped with multi-layer insert ring

Microelectronic fabrication with corrosion inhibited bond pad

Colors only process to reduce package yield loss

METHOD OF FORMING A BUMP ON A COPPER PAD

Method to form bump in bumping technology

METHOD FOR BUMPING AND BACKLAPPING A SEMICONDUCTOR WAFER