Yang Hong Heng

Person

Muar, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip assembly
- Patent number 8,482,119
- Issue date Jul 9, 2013
- Infineon Technologies AG
- Fong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having profiled elements extending from planar su...
- Patent number 8,030,742
- Issue date Oct 4, 2011
- Infineon Technologies
- Boon Kian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for a switched-mode power supply and method fo...
- Patent number 7,923,827
- Issue date Apr 12, 2011
- Infineon Technologies AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with non-conductive connective bar
- Patent number 7,795,712
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Alvin Wee Beng Tatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of encapsulated package
- Patent number 7,674,657
- Issue date Mar 9, 2010
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH V-SHAPED NOTCH CREEPAGE STRUCTURE
- Publication number 20220157681
- Publication date May 19, 2022
- STMicroelectronics SDN BHD
- Yang Hong HENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING
- Publication number 20100193920
- Publication date Aug 5, 2010
- INFINEON TECHNOLOGIES AG
- Yong Chern Poh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip assembly
- Publication number 20090315172
- Publication date Dec 24, 2009
- Fong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20090140403
- Publication date Jun 4, 2009
- INFINEON TECHNOLOGIES AG
- Boon Kian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame with Non-Conductive Connective Bar
- Publication number 20090051017
- Publication date Feb 26, 2009
- INFINEON TECHNOLOGIES AG
- Beng Tatt Wee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module for a Switched-Mode Power Supply and Method fo...
- Publication number 20090001535
- Publication date Jan 1, 2009
- INFINEON TECHNOLOGIES AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reliably Positioning Solder on a Die Pad for Attaching a...
- Publication number 20080308952
- Publication date Dec 18, 2008
- INFINEON TECHNOLOGIES AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacture of Encapsulated Package
- Publication number 20080157433
- Publication date Jul 3, 2008
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS

Yang Hong Heng

Person

Patents Grantslast 30 patents

Semiconductor chip assembly

Electronic device having profiled elements extending from planar su...

Semiconductor module for a switched-mode power supply and method fo...

Lead frame with non-conductive connective bar

Method of manufacture of encapsulated package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH V-SHAPED NOTCH CREEPAGE STRUCTURE

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Semiconductor chip assembly

ELECTRONIC DEVICE

Lead Frame with Non-Conductive Connective Bar

Semiconductor Module for a Switched-Mode Power Supply and Method fo...

Method for Reliably Positioning Solder on a Die Pad for Attaching a...

Method of Manufacture of Encapsulated Package