Yang Hong-Zen

Follow

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making UBM pads and bumps on wafer
- Patent number 7,015,130
- Issue date Mar 21, 2006
- Advanced Semiconductor Engineering, Inc.
- Chi-Long Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for making UBM pads and bumps on wafer
- Publication number 20040110364
- Publication date Jun 10, 2004
- Chi-Long Tsai
- H01 - BASIC ELECTRIC ELEMENTS