Yang Jae Park

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-connection device
- Patent number 11,362,452
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Sung-Hyup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting device and electronic device including the same
- Patent number 10,777,920
- Issue date Sep 15, 2020
- Samsung Electronics Co., Ltd.
- Sung-Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection terminal device and electronic device having the same
- Patent number 10,355,429
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Myeong-Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing of metal oxide nanoparticles and metal oxi...
- Patent number 10,193,133
- Issue date Jan 29, 2019
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNLOGY
- Sung Oh Cho
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Connecting terminal device and electronic device including the same
- Patent number 9,768,537
- Issue date Sep 19, 2017
- Samsung Electronics Co., Ltd.
- Kyung-Jong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240355549
- Publication date Oct 24, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ye Rin HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240249887
- Publication date Jul 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yang-Seok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240062966
- Publication date Feb 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yang-Seok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CONNECTION DEVICE
- Publication number 20200052427
- Publication date Feb 13, 2020
- Samsung Electronics Co., Ltd.
- Sung-Hyup LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20180358722
- Publication date Dec 13, 2018
- Samsung Electronics Co., Ltd.
- Sung-Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION TERMINAL DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20180026406
- Publication date Jan 25, 2018
- Samsung Electronics Co., Ltd.
- Myeong-Hwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING TERMINAL DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20160294095
- Publication date Oct 6, 2016
- Samsung Electronics Co., Ltd.
- Kyung-Jong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING OF METAL OXIDE NANOPARTICLES AND METAL OXI...
- Publication number 20150303449
- Publication date Oct 22, 2015
- Korea Advanced Institute of Science and Technology
- Sung Oh Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MOTOR FIXING STRUCTURE AND MOTOR ASSEMBLY
- Publication number 20090045685
- Publication date Feb 19, 2009
- Samsung Electronics Co., Ltd.
- Sang Pil Yoon
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Wafer guide and semiconductor wafer drying apparatus using the same
- Publication number 20060162748
- Publication date Jul 27, 2006
- Jong-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Yang Jae Park

Person

Patents Grantslast 30 patents

Multi-connection device

Connecting device and electronic device including the same

Connection terminal device and electronic device having the same

Method for manufacturing of metal oxide nanoparticles and metal oxi...

Connecting terminal device and electronic device including the same

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

MULTILAYER ELECTRONIC COMPONENT

MULTI-CONNECTION DEVICE

CONNECTING DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME

CONNECTION TERMINAL DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

CONNECTING TERMINAL DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME

METHOD FOR MANUFACTURING OF METAL OXIDE NANOPARTICLES AND METAL OXI...

MOTOR FIXING STRUCTURE AND MOTOR ASSEMBLY

Wafer guide and semiconductor wafer drying apparatus using the same