Yang Jiao

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL ORGANIC FRAMEWORKS (MOFS) FILLER FOR ENABLING LOW CTE AND LOW...
- Publication number 20230309220
- Publication date Sep 28, 2023
- Intel Corporation
- Yang JIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...
- Publication number 20230307379
- Publication date Sep 28, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY
- Publication number 20200146183
- Publication date May 7, 2020
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR